EP3SE50F780C4G vs EP3SE50F780C4L 对比
详细并排对比 EP3SE50F780C4G 出自 Intel 和 EP3SE50F780C4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE50F780C4G | EP3SE50F780C4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $593.00 | $1,320.00 |
| Family | Stratix III E | Stratix III |
| Series | Stratix III | Stratix III E |
| Logic Elements | 47,500 LE | — |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 5.76 Mbit (5760000 bit) | 5,760,000 bits |
| Number of I/Os | 488 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count from datasheet] | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Process Technology | 40 nm TSMC | — |
| Core Supply Voltage | 1.1 V | — |
| 工作温度范围 | 0 C to +85 C (commercial) | — |
| 封装 | 780-ball FBGA (FCBGA) | 780-ball FCBGA (Flip-Chip BGA) |
| 安装类型 | Surface Mount (SMD/SMT) | — |
| RoHS 状态 | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| MSL 等级 | MSL3 (per JEDEC J-STD-020) | — |
| Configuration Memory | SRAM-based (volatile, requires configuration device) | — |
| Design Software | Quartus II | — |
| Logic Elements (LE) | — | 47,500 |
| User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| Process Node | — | 40 nm |
| Core Voltage | — | 1.1 V |
| Speed Grade | — | C4 (commercial, speed 4) |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| 工作温度 | — | [DATA_NEEDED: full industrial/commercial grade] |
| Transceivers | — | [DATA_NEEDED: per Stratix III E variant] |
| PLLs | — | [DATA_NEEDED: PLL count] |