EP3SE50F780C4N vs EP3SE50F780C3N 对比
详细并排对比 EP3SE50F780C4N 出自 Intel 和 EP3SE50F780C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE50F780C4N | EP3SE50F780C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,430.00 | $717.12 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Embedded Memory Bits | 5,760,000 | — |
| Embedded Memory (M9K/M144K blocks) | 488 (per family datasheet) | — |
| Number of LABs | 1900 | — |
| Maximum User I/Os | 488 | 488 |
| DSP Blocks (18x18 multipliers) | 432 | — |
| PLLs | 12 (per family datasheet) | — |
| Maximum Operating Frequency | 717 MHz | — |
| Transceiver Channels | Up to 12 (per family, model-dependent) | — |
| Transceiver Data Rate | Up to 6.375 Gbps (per Stratix III E family) | — |
| Process Node | 40 nm | — |
| 封装 | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| 电源电压 | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) | — |
| 工作温度 | 0C to +85C (C4 commercial grade) | — |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| RoHS 状态 | Lead-free / RoHS compliant | Compliant |
| MSL 等级 | 3 (per JEDEC J-STD-020, FBGA package) | — |
| Hard Memory Controller | DDR2/DDR3 SDRAM (per Stratix III E family) | — |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (M9K blocks) | — | 312 |
| Total Embedded Memory | — | 5,760 Kbit (5.76 Mbit) |
| DSP Blocks | — | 432 |
| Number of PLLs | — | 4 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Speed Grade | — | C3 (medium) |
| Temperature Grade | — | Commercial (0C to +85C) |
| Lead-Free | — | Yes |