EP3SL200F1517I4LN vs EP3SE260F1517I4N 对比

详细并排对比 EP3SL200F1517I4LN 出自 Intel 和 EP3SE260F1517I4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260F1517I4N EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel

EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel

EP3SE260F1517I4N ⚠ 最后一次采购

规格对比

参数 EP3SL200F1517I4LN EP3SE260F1517I4N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $6,300.00 $10,500.00
Family Stratix III L —
Logic Elements 200,000 255,000
Embedded Memory Bits 10,901,504 16,672,768 bits
Logic Array Blocks (LABs) 8,000 —
User I/O Pins 976 976
封装 1517-BBGA, FCBGA 1517-BBGA, FCBGA
Process Technology 65 nm TSMC low-power TSMC 65 nm
工作温度 -40C to +100C (Industrial) -40 °C to +100 °C (Industrial)
安装类型 Surface Mount (BGA) Surface Mount (BGA)
RoHS 状态 Compliant —
Lead-Free Yes —
MSL 等级 [DATA_NEEDED: MSL moisture sensitivity level] [DATA_NEEDED: MSL classification]
Supply Voltage Core [DATA_NEEDED: VCC core voltage] —
Transceiver Data Rate (max) [DATA_NEEDED: max transceiver rate] —
DSP Blocks (18x18 multipliers) 384 —
DSP Performance 288 GMACS —
Configuration Method Passive Parallel / Active Serial / JTAG —
Ball Pitch 1.0 mm —
Package Dimensions 40 mm x 40 mm —
Series — Stratix III E
Embedded Memory (M9K/M144K blocks) — [DATA_NEEDED: total Kbits and block count]
Transceivers — [DATA_NEEDED: number of full-duplex channels]
Transceiver Data Rate — 600 Mbps to 6.375 Gbps
DSP Blocks — [DATA_NEEDED: number of 18x18 multipliers]
PLLs — [DATA_NEEDED: total PLL count]
Core Voltage — 1.1 V
Package Body Size — [DATA_NEEDED: mm x mm]
Operating Temperature Grade — Industrial (I4)
Lead-Free / RoHS — [DATA_NEEDED: explicit RoHS statement]

数据手册与资源

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