EP3SL200H780I3 vs EP3SL200H780C2 对比
详细并排对比 EP3SL200H780I3 出自 Intel 和 EP3SL200H780C2 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL200H780I3 | EP3SL200H780C2 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7,980.00 | $6,950.00 |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | — |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | 488 |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| 工作温度 | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| 封装 | 780-BBGA, FCBGA (HBGA-780) | 780-BBGA, FCBGA |
| 安装类型 | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| LABs / CLBs | — | 8000 |
| Total Memory Bits | — | 10,901,504 |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| Process Node | — | 65 nm |
| Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Voltage - I/O | — | [DATA_NEEDED: I/O voltage] |
| DSP Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Transceivers | — | [DATA_NEEDED: transceiver count for H780] |
| RoHS 状态 | — | Compliant |
| Lead Free | — | Yes |