EP4CE75F29C8L vs EP4CE75F29C7 对比
详细并排对比 EP4CE75F29C8L 出自 Intel 和 EP4CE75F29C7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4CE75F29C8L | EP4CE75F29C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $109.80 | $199.96 |
| Family | Cyclone IV E | Cyclone IV E |
| Device Type | FPGA (Field-Programmable Gate Array) | Field Programmable Gate Array (FPGA) |
| Logic Elements (LE) | 75,408 | — |
| Configurable Logic Blocks (CLBs) | 4,713 | — |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) | — |
| Embedded Multipliers (18x18) | 426 | — |
| General-Purpose I/O Pins | 426 (max) | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Speed Grade | C8 (commercial, 8 speed bin) | — |
| 工作温度 | 0C to 85C (commercial) | — |
| 封装 | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-ball FBGA (F29, 29 mm) |
| Ball Count | 780 | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | Compliant (lead-free) | Compliant |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Logic Elements (LEs) | — | 75 408 |
| Embedded Memory Bits | — | 2 810 880 (4.5 Mbit, M9K blocks) |
| Embedded Multipliers (18 x 18) | — | 274 |
| Maximum User I/O | — | 426 |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Commercial (0 C to +85 C) |
| MSL 等级 | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | JTAG, Active Serial (AS), Passive Serial (PS) |
| Block Memory Type | — | M9K (9 Kbit blocks) |
| Design Tool | — | Intel Quartus Prime (Lite / Standard / Pro) |