EP4SGX110HF35I3G vs EP4SGX110HF35C3G 对比
详细并排对比 EP4SGX110HF35I3G 出自 Intel 和 EP4SGX110HF35C3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX110HF35I3G | EP4SGX110HF35C3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7,900.00 | $3,128.75 |
| Logic Elements | 105,600 | 105,600 |
| Embedded Memory Bits | 9,793,536 (9.4 Mbit) | 9,793,536 |
| Maximum User I/O Pins | 488 | — |
| Multipliers (18x18) | 352 | — |
| Core Supply Voltage (nominal) | 0.9 V | — |
| 封装 | 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch | 1152-BBGA, FCBGA (HF35, 35x35 mm) |
| Family | Stratix IV GX | Stratix IV |
| Speed/Grade | I3 (Industrial, -3 speed) | — |
| 工作结温 | -40 C to +100 C | — |
| Multi-Gigabit Transceivers | 8 channels (3.125 Gbps to 8.5 Gbps per family datasheet) | — |
| Hard IP Blocks | PCIe Gen1/Gen2, external memory PHY | — |
| 安装类型 | Surface Mount (Flip-Chip BGA) | Surface Mount |
| MSL 等级 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| RoHS 状态 | Compliant | Compliant (lead-free FBGA) |
| Lead-Free / Halogen-Free | Lead-free | — |
| Process Technology | 40 nm low-power CMOS | 40 nm TSMC |
| Configuration Memory | SRAM-based (volatile, requires configuration device) | — |
| Series | — | Stratix IV GX |
| Sub-family | — | GX (transceiver-optimized) |
| Embedded Memory (Kbits) | — | 9,564 Kbit (9793536 bits) |
| Number of Logic Array Blocks | — | [DATA_NEEDED: LAB count] |
| Number of Registers | — | [DATA_NEEDED: register count] |
| Maximum User I/O | — | 488 |
| Transceiver Channels | — | 8 (up to 8.5 Gbps) |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate | — | 3.125 Gbps (low-power mode) - 8.5 Gbps |
| 18x18 Multipliers | — | [DATA_NEEDED: DSP block count] |
| PCIe Hard IP | — | Yes |
| Package Code | — | HF35 (FineLine BGA, 35mm) |
| Speed Grade | — | C3 (commercial) |
| 工作温度 | — | [DATA_NEEDED: junction temperature range] |