EP4SGX360FF35C2XN vs EP4SGX360KF40C2N 对比
详细并排对比 EP4SGX360FF35C2XN 出自 Intel 和 EP4SGX360KF40C2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX360FF35C2XN | EP4SGX360KF40C2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2,600.00 | $1,850.00 |
| Family | Stratix IV GX | EP4SGX360 |
| Logic Elements | 353,600 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | — |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | C2 |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| 封装 | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1517-ball FC-FBGA (KF40) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Stratix IV GX |
| Logic Elements (LEs) | — | 353,600 |
| Logic Array Blocks (LABs) | — | 14,144 |
| User I/Os | — | 744 |
| DSP Blocks | — | Yes (9x9 / 12x12 / 18x18 / 36x36 multipliers) |
| DSP Block Max Frequency | — | 600 MHz |
| Core Supply Voltage | — | 0.9 V |
| Manufacturer | — | Intel (formerly Altera) |