EP4SGX360KF40C2 vs EP4SGX360KF40I3 对比
详细并排对比 EP4SGX360KF40C2 出自 Intel 和 EP4SGX360KF40I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX360KF40C2 | EP4SGX360KF40I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10,400.00 | $1,925.00 |
| Family | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm TSMC |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | 48-bit variable-precision multipliers |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | I3 (industrial performance grade) |
| 工作温度 | 0C to +85C (commercial) | -40C to +100C (industrial) |
| 封装 | 1517-ball FCBGA, 42.5 x 42.5 mm | 1517-ball FCBGA (FC-FBGA) |
| 安装类型 | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| MSL 等级 | MSL3 (per JEDEC J-STD-020) | — |
| RoHS 状态 | Compliant | Compliant |
| Series | — | EP4SGX360 |
| Logic Elements (LEs) | — | 353600 |
| Embedded Memory | — | 23105536 bits (approx 17.5 Mbits / 22838 Kb) |
| Maximum User I/Os | — | 744 |
| Transceivers | — | 24 channels (up to 8.5 Gbps) |
| Lead-Free | — | Yes |
| Design Software | — | Quartus II (legacy) / Quartus Prime |