EP4SGX530HH35C4 vs EP4SGX530HH35C3 对比
详细并排对比 EP4SGX530HH35C4 出自 Intel 和 EP4SGX530HH35C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX530HH35C4 | EP4SGX530HH35C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3,120.00 | $2,398.00 |
| Series | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA | — |
| Logic Elements | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 LABs / 212,480 equivalent LEs | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Maximum User I/O Pins | 564 | — |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Supply Voltage | 0.9 V | — |
| 封装 | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) | 1152-BBGA / FCBGA (HFBGA) |
| Speed Grade | HH35 | C3 |
| 工作温度 | 0 C to 85 C (Commercial, -C4 suffix) | 0C to +85C (Commercial) |
| Transceivers | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] | 24 channels, up to 8.5 Gbps |
| DSP Blocks | [DATA_NEEDED: block count for this density] | 1024 (18x18 multipliers) |
| PLLs | 8 fractional PLLs | — |
| 安装类型 | Surface Mount (flip-chip BGA) | Surface Mount |
| MSL 等级 | MSL3 (per BGA package standard) | — |
| RoHS 状态 | Compliant | Compliant |
| Family | — | Stratix IV |
| Logic Elements (LE) | — | 531,200 |
| LABs / CLBs | — | 21,248 |
| Total RAM Bits | — | 28,033,024 |
| User I/O Count | — | 564 |
| Core Voltage | — | 0.87 V to 0.93 V |