EPF10K200EBI600-2 vs EPF10K200EBC600-3 对比
详细并排对比 EPF10K200EBI600-2 出自 Intel 和 EPF10K200EBC600-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteIntel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 Obsolete规格对比
| 参数 | EPF10K200EBI600-2 | EPF10K200EBC600-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $198.00 | $575.00 |
| Family | FLEX 10KE | FLEX 10KE |
| System Gates | 200,000 | 200,000 |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded RAM | 98,304 bits | — |
| Embedded Array Blocks (EABs) | 12 (typical for this density) | — |
| User I/O Pins | 470 | — |
| Supply Voltage (VCCINT) | 2.5 V | — |
| Propagation Delay | 0.4 ns (per -2 speed grade) | — |
| 工作温度 | 0 C to 70 C (commercial) | 0C to +70C (commercial) |
| 封装 | BGA-600, 45 x 45 mm, 1.27 mm pitch | 600-ball FineLine BGA, 45 x 45 mm |
| Logic Family | CMOS, SRAM-based | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / ByteBlaster (SRAM configuration) | — |
| RoHS 状态 | Compliant (lead-free package) | [DATA_NEEDED: RoHS compliance status] |
| Series | — | FLEX-10KE |
| Logic Elements / Cells | — | 9,984 |
| Embedded Memory (EABs) | — | 24,576 bits |
| Maximum User I/O | — | 470 |
| Number of PLLs | — | 4 |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | — | 0.22 micrometer SRAM |
| Speed Grade | — | -3 (commercial) |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |