EPF10K200EFC672-3 vs EPF10K200EFC672-1 对比
详细并排对比 EPF10K200EFC672-3 出自 Intel 和 EPF10K200EFC672-1 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 Obsolete规格对比
| 参数 | EPF10K200EFC672-3 | EPF10K200EFC672-1 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $115.00 | $198.00 |
| Series | FLEX 10KE | — |
| Number of Logic Elements / Cells | 9,984 | — |
| Number of LABs / CLBs | 1248 | — |
| Total RAM Bits | 98,304 bits (12 EABs of 8 Kbits) | — |
| Number of I/O | 470 | — |
| Number of Gates (typical) | 200,000 | — |
| Supply Voltage - Operating | 2.3 V to 2.7 V (2.5 V nominal) | — |
| Process Technology | 0.22 µm CMOS | CMOS, SRAM-based |
| Maximum Operating Frequency | 166.67 MHz | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| 封装 / 外壳 | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) | — |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | 0 °C to +70 °C (commercial) | 0 C to 70 C (Commercial) |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) | — |
| Number of PLLs | 4 | — |
| RoHS 状态 | [DATA_NEEDED: rohs status] | Compliant |
| MSL 等级 | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Family | — | FLEX-10KE |
| Logic Elements | — | 9,984 |
| Typical Gates | — | 200,000 |
| User I/Os | — | 470 |
| Embedded Memory (bits) | — | 98,304 |
| Logic Array Blocks (LABs) | — | 1,248 |
| 封装 | — | 672-FBGA (FineLine BGA), 27x27 mm, 1.27 mm pitch |
| Speed Grade | — | -1 |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, True-LVDS |
| Core Voltage | — | 2.5 V (typical, FLEX-10KE) |
| Supply Voltage - Max | — | 3.3 V (I/O) |