EPF10K200SBC356-1 vs EPF10K200SBC356-1X 对比
详细并排对比 EPF10K200SBC356-1 出自 Intel 和 EPF10K200SBC356-1X 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200SBC356-1 - 200K FLEX 10K FPGA, 274 I/O, 356-BGA | Intel / Altera
EPF10K200SBC356-1 NrndIntel
EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
EPF10K200SBC356-1X ⚠ 最后一次采购规格对比
| 参数 | EPF10K200SBC356-1 | EPF10K200SBC356-1X |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $580.00 | $138.00 |
| Family | FLEX 10K (Classic embedded array) | FLEX 10KE |
| Logic Elements / Cells | 9,984 | — |
| Number of LABs / CLBs | 1,248 | — |
| Total RAM Bits | 98,304 | 39,616 |
| Equivalent Gate Count | 200,000 (system gates ~513,000) | — |
| Number of User I/Os | 274 | — |
| Propagation Delay | 0.4 ns (-1 speed grade) | — |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| 工作温度 | 0 °C to 70 °C (commercial) | — |
| 封装 | 356-LBGA (35 x 35 mm, 1.27 mm pitch) | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Logic Family / Process | CMOS SRAM LUT | — |
| Configuration Method | SRAM (volatile) - requires configuration device or JTAG | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | — |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| Series | — | FLEX-10KS |
| Typical System Gates | — | 200,000 |
| Maximum System Gates | — | 513,000 |
| Logic Elements (LEs) | — | 9,984 |
| Logic Array Blocks (LABs) | — | 1,248 |
| Embedded Array Blocks (EABs) | — | 12 |
| User I/Os | — | 274 |
| Process Technology | — | 0.22 µm CMOS |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | — | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) |
| Operating Temperature Grade | — | Commercial |
| Speed Grade | — | -1 (fastest commercial bin) |
| JTAG Support | — | IEEE Std. 1149.1 boundary scan + ISP |
| Lead Free / RoHS | — | Yes (per -1X suffix) |
| Configuration Mode | — | SRAM-based, ISP via JTAG |