EPF10K200SBC356-2 vs EPF10K200SBC356-1X 对比
详细并排对比 EPF10K200SBC356-2 出自 Altera 和 EPF10K200SBC356-1X 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
EPF10K200SBC356-1X ⚠ 最后一次采购规格对比
| 参数 | EPF10K200SBC356-2 | EPF10K200SBC356-1X |
|---|---|---|
| 品牌 | Altera | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $178.00 | $138.00 |
| Series | FLEX 10KS | FLEX-10KS |
| Family | FLEX 10KS (Embedded Programmable Logic) | FLEX 10KE |
| Logic Elements / Cells | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory Bits (EAB) | 98304 | — |
| System Gates | 200,000 | — |
| User I/Os | 274 | 274 |
| Number of I/O Banks | 8 | — |
| Supply Voltage (Core) | 2.5 V (2.375 V - 2.625 V) | — |
| I/O Voltage (PCI-compatible) | 3.3 V / 5.0 V tolerant | — |
| Propagation Delay | 0.4 ns (per datasheet) | — |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS |
| 工作温度 | 0C to +70C (Commercial) | — |
| Speed Grade | -2 | -1 (fastest commercial bin) |
| 封装 | 356-LBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Configuration | SRAM-based (volatile, requires configuration device) | — |
| Boundary Scan | Yes (JTAG IEEE 1149.1) | — |
| PLL | Yes (on-chip) | — |
| RoHS 状态 | Non-compliant (legacy part) | — |
| Typical System Gates | — | 200,000 |
| Maximum System Gates | — | 513,000 |
| Logic Elements (LEs) | — | 9,984 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 39,616 |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | — | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) |
| Operating Temperature Grade | — | Commercial |
| JTAG Support | — | IEEE Std. 1149.1 boundary scan + ISP |
| Lead Free / RoHS | — | Yes (per -1X suffix) |
| Configuration Mode | — | SRAM-based, ISP via JTAG |