EPF10K200SRC240-3N vs EPF10K20RC240-3 对比
详细并排对比 EPF10K200SRC240-3N 出自 Intel 和 EPF10K20RC240-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K200SRC240-3N | EPF10K20RC240-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $162.00 | $21.20 |
| Family | FLEX 10KE | FLEX 10K |
| Typical System Gates | 200,000 | — |
| Logic Elements (LEs) | 9,984 | 12,288 |
| Maximum Logic Elements | 9,984 | — |
| Embedded Array Blocks (EABs) | 24 | 6 (2 Kbit each) |
| Maximum User RAM Bits | 98,304 | — |
| Logic Array Blocks (LABs) | 1,248 | 189 |
| User I/Os | 470 (effective); 182 user pins per RQFP-240 with the rest assigned to dedicated functions | 470 (max per package) |
| Propagation Delay (tPD) | 0.40 ns | — |
| Internal Operating Frequency | 166.67 MHz | — |
| Process Technology | 0.22 µm CMOS SRAM | 0.42 µm CMOS, 5 metal layers |
| Core Supply Voltage | 2.5 V | — |
| MultiVolt I/O Support | 2.5 V and 3.3 V interfaces | — |
| 工作温度 | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| 封装 | 240-pin RQFP (Power QFP) with exposed pad, 34.6 x 34.6 mm, 0.5 mm pitch | 240-BFQFP Exposed Pad (RQFP-240) |
| 安装类型 | Surface Mount | Surface Mount |
| JTAG Support | IEEE Std 1149.1 Boundary-Scan (contributes up to 31,250 gates of test logic) | — |
| Configuration Method | SRAM-based; requires external configuration device (e.g., EPC2) for power-up loading | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | unknown (legacy Altera part, likely non-RoHS) |
| Speed Grade | -3 (commercial) | -3 |
| Series | — | FLEX-10K® |
| Typical Gates | — | 20,000 |
| Flip-Flops | — | 1,152 |
| Total EAB RAM | — | 12 Kbits |
| Core Supply Voltage (VCCINT) | — | 5 V |
| I/O Supply Voltage (VCCIO) | — | 3.3 V or 5 V tolerant |
| Propagation Delay (tpd) | — | 0.4 ns |
| Maximum Internal Frequency | — | 125 MHz |
| Configuration Interface | — | JTAG (IEEE 1149.1) + serial configuration PROM |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |
| Programming | — | SRAM-based, in-system reconfigurable |