EPF10K250EBI600-3 vs EPF10K250EFC672-3 对比
详细并排对比 EPF10K250EBI600-3 出自 Intel 和 EPF10K250EFC672-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K250EBI600-3 | EPF10K250EFC672-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $110.00 | $99.50 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 | — |
| Typical Gate Count | 250,000 system gates | — |
| Embedded System Blocks (ESBs) | 12 | — |
| Maximum User I/O | 470 | — |
| Dedicated Inputs | 4 | — |
| PLLs | 4 | — |
| On-chip RAM | Up to 40 Kbits | — |
| 封装 | 600-ball BGA (HBGA) | 672-ball FineLine BGA (FC) |
| Ball Pitch | 1.93 mm | 1.0 mm |
| Core Voltage | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] | — |
| 工作温度 | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] | — |
| Speed Grade | -3 (fastest) | -3 (fastest) |
| Process Technology | 0.22 µm CMOS, 4-layer metal | 0.25 um CMOS, 5-layer metal |
| Configuration Method | SRAM, requires external configuration device (EPC series) | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Not specified (SnPb / tin-lead finish per legacy distributor listing) | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] |
| Lead-free | no (legacy tin-lead per distributor description) | — |
| Product Type | — | FPGA (Field Programmable Gate Array) |
| Maximum Typical Gates | — | 250,000 |
| Logic Elements (LEs) | — | 12,160 |
| Embedded Memory (EAB) | — | 655,360 bits (80 EABs x 2,048 bits each) |
| Logic Array Blocks (LABs) | — | 392 (8 LEs per LAB) |
| User I/O Pins | — | 470 |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Temperature Grade | — | Commercial (0C to +70C) |
| Configuration Mode | — | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |