EPF10K250EGC599-3 vs EPF10K250EGC599-1 对比
详细并排对比 EPF10K250EGC599-3 出自 Altera 和 EPF10K250EGC599-1 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K250EGC599-3 | EPF10K250EGC599-1 |
|---|---|---|
| 品牌 | Altera | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $135.00 | $162.00 |
| Family | FLEX 10KE | — |
| Logic Elements | 12,160 | 40,960 |
| Typical Gates | 250,000 | — |
| Embedded Memory (Bits) | 409,600 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum User I/O | 470 | — |
| 封装 | 599-pin PGA (HIPGA / Heat-dissipating PGA) | 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) |
| Package Pin Count | 599 | — |
| Speed Grade | -3 | — |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Core Voltage | 3.3 V | — |
| I/O Voltage Support | 3.3 V / 2.5 V / 1.8 V (MultiVolt) | — |
| Process Technology | 0.22 micron CMOS, SRAM-based configuration | — |
| Configuration Method | Serial or parallel, SRAM configuration cell | — |
| 安装类型 | Through-hole PGA | Through-Hole (PGA) |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | unknown (ceramic HIPGA package historically non-RoHS) |
| Terminal Form | PIN/PEG | — |
| Product Type | — | FPGA (Field-Programmable Gate Array) |
| Series | — | FLEX 10K |
| Equivalent Gates | — | 250,000 |
| Flip-Flops | — | 12,160 |
| User I/O Pins | — | 470 |
| Embedded Array Blocks (EAB) | — | 20 (2 Kbit each) |
| 引脚数量 | — | 599 |
| 工作温度 | — | 0C to +70C (Commercial) |
| Configuration | — | SRAM (volatile), serial/parallel EPROM |
| Process Node | — | 0.42 µm CMOS |
| I/O Standard Support | — | 5.0 V PCI, LVTTL, LVCMOS |
| Programming Interface | — | JTAG (IEEE 1149.1), passive serial |
| MSL 等级 | — | [DATA_NEEDED: moisture sensitivity level] |