EPF10K30EFC256-2N vs EPF10K30EFC256-3N 对比
详细并排对比 EPF10K30EFC256-2N 出自 Intel 和 EPF10K30EFC256-3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N Obsolete规格对比
| 参数 | EPF10K30EFC256-2N | EPF10K30EFC256-3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $48.57 | $58.00 |
| Series | FLEX 10KE | — |
| Family | FLEX 10KE Embedded Programmable Logic Family | FLEX 10KE |
| Typical Gates | 30,000 | — |
| Logic Elements (LEs) | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| Embedded Array Blocks (EABs) | 6 | 6 |
| User I/Os | 246 | — |
| Logic Cells | 1728 | — |
| Propagation Delay | 0.6 ns (per digchip listing; internal frequency 80 MHz) | — |
| Number of Logic Elements | 24576 | — |
| 工作温度 | 0 °C to +70 °C (Commercial) | 0 C to +70 C (Commercial) |
| 电源电压 | [DATA_NEEDED: core and I/O rail voltages] | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.22 um CMOS |
| 封装 | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch | 256-pin FineLine BGA (FBGA) |
| 安装类型 | Surface Mount | — |
| Configuration | Passive Serial / Active Serial / JTAG | — |
| Lead Free / RoHS | Non-RoHS (legacy, SnPb finish per FBGA-256 family) | — |
| Speed Grade | -2N (mid-grade, 0.6 ns) | — |
| Logic Elements / Cells | — | 1,728 |
| Gate Count | — | 30,000 gates |
| Logic Array Blocks (LABs) | — | 216 |
| Embedded RAM | — | 24,576 bits |
| Maximum User I/Os | — | 176 |
| Core Voltage | — | 2.5 V |
| I/O Standard Support | — | MultiVolt 2.5 V / 3.3 V / 5.0 V |
| Internal Frequency | — | 80 MHz (typical) |
| Propagation Delay (tPD) | — | 0.6 ns |
| Bidirectional I/O Performance | — | up to 212 MHz |
| PCI Compliance | — | PCI SIG 2.2 at 33 / 66 MHz |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |
| Open-Drain I/O Option | — | Yes (per pin) |