EPM570GF256I5 vs EPM570GF256C4N 对比
详细并排对比 EPM570GF256I5 出自 Intel 和 EPM570GF256C4N 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPM570GF256I5 | EPM570GF256C4N |
|---|---|---|
| 品牌 | Intel | Altera |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $27.62 | $9.45 |
| Family | MAX II | MAX II G |
| Device Type | CPLD - Complex Programmable Logic Device | — |
| Logic Elements | 570 | — |
| Equivalent Macrocells | 440 | — |
| Number of I/O | 160 | — |
| Number of Logic Blocks | [DATA_NEEDED: number of logic blocks] | — |
| Propagation Delay tPD (max) | 5.4 ns | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Programmable Type | In System Programmable | — |
| Non-Volatile Memory | Yes (Flash-based) | — |
| Internal Supply Voltage | 1.71 V to 1.89 V | — |
| I/O Standards Supported | LVTTL, LVCMOS 1.5/1.8/2.5/3.3 V | — |
| 工作温度范围 | -40 °C to 100 °C (Industrial) | — |
| 封装 | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA (FBGA-256) |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| JTAG Support | IEEE 1149.1 boundary-scan | — |
| Process Technology | 0.18 µm 6-layer-metal flash CMOS | — |
| RoHS 状态 | Lead-free (per FindIC listing) | — |
| Device Series | — | EPM570G |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 212 |
| Speed Grade | — | C4 (tPD = 4 ns) |
| Pin-to-Pin Delay (tPD) | — | 4 ns |
| Internal fMAX | — | 304 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 17 x 17 mm |
| Core Voltage | — | 1.8 V |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 工作温度 | — | -40 °C to +125 °C (industrial) |
| Configuration Memory | — | Flash (non-volatile, instant-on) |
| Programming Interface | — | JTAG (IEEE 1149.1), in-system programmable |
| Lead-Free / RoHS | — | Lead-free, FBGA package |