EPM570GM100C5N vs EPM570GM256C5N 对比

详细并排对比 EPM570GM100C5N 出自 Intel 和 EPM570GM256C5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPM570GM100C5N EPM570GM256C5N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $10.40 $18.60
Family MAX II CPLD - Complex Programmable Logic Device
Device Type CPLD (Complex Programmable Logic Device) —
Macro Cells 440 440
User I/Os 76 —
Logic Elements 440 —
引脚数 100 —
Package Type Micro FBGA-100 (MBGA), 6 x 6 mm, 0.5 mm pitch —
Pin-to-Pin Delay (tPD) 5.4 ns —
Maximum Frequency 201.1 MHz —
工作温度 -40C to +125C (industrial) 0 °C to +85 °C (commercial)
电源电压 1.8 V core (MultiVolt I/O 1.5 V to 3.3 V) —
Program Memory Type Flash (non-volatile, in-system programmable) —
Programming Interface JTAG (IEEE 1149.1) —
安装类型 Surface Mount —
Lead Free / RoHS Yes / Compliant —
Logic Family CMOS —
Series — MAX II
Logic Array Blocks (LABs) — 57
Number of I/Os — 160
Maximum Operating Frequency — 304 MHz
Maximum Internal Frequency (datasheet fMAX) — 201.1 MHz
Pin-to-Pin Logic Delay (Speed Grade C5) — 5 ns
Operating Supply Voltage (Core VCCINT) — 1.71 V to 1.89 V (1.8 V nominal)
I/O Bank Supply Voltages — 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O)
Process Technology — 0.18 um flash-based CMOS
Programmable Type — In System Programmable (ISP) via JTAG
封装 / 外壳 — 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch
安装方式 — SMD/SMT
Packaging — Tray
Lead Free / RoHS Status — See manufacturer page; legacy part - verify per lot
Configuration Memory — Internal flash (non-volatile, instant-on)
JTAG Support — Yes (IEEE 1149.1 / 1532)
Vertical Migration — Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package

数据手册与资源

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