EPM570ZM256I8N vs EPM570ZM256C6N 对比
详细并排对比 EPM570ZM256I8N 出自 Intel 和 EPM570ZM256C6N 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPM570ZM256I8N | EPM570ZM256C6N |
|---|---|---|
| 品牌 | Intel | Altera |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $27.90 | $24.10 |
| Series | MAX II | MAX II |
| Family | MAX II Z (zero-power, 1.8 V core) | — |
| Macro Cells | 440 | — |
| Logic Elements | 570 | — |
| Maximum Internal Frequency | 118.3 MHz | — |
| Process Technology | 0.18 micrometer, 6-layer-metal flash | 0.18 micron CMOS, 6-layer-metal flash |
| User Flash Memory | 8 Kbit | 8 Kbits |
| Number of Logic Array Blocks (LABs) | 57 | — |
| Macrocells per LAB | 16 | — |
| Number of Global Clocks | 4 | — |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V | — |
| MultiVolt I/O Bank Supply | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Programmable Type | In System Programmable (ISP) via JTAG | In System Programmable (Flash, non-volatile) |
| User I/O Pins (max) | 212 | — |
| Propagation Delay (tPD1) | 9.9 ns | — |
| 封装 | 256-MBGA (Micro FBGA), 11 mm x 11 mm | 256-MBGA (FineLine BGA) 11x11 mm |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| 工作温度 | -40 C to +100 C (Industrial) | 0C to +85C (commercial) |
| RoHS 状态 | Compliant | Lead-free (per Heisener listing) |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 160 |
| Pin/Pitch | — | 256 balls, 0.5 mm pitch (Heisener description) |
| Internal Core Voltage | — | 1.71 V to 1.89 V (1.8 V typical) |
| I/O Voltage Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant |
| Propagation Delay (tPD) | — | 9 ns (per Heisener listing for Z speed grade) |