H5CG28AGBDX022 vs H5CG34MEBDX030 对比

详细并排对比 H5CG28AGBDX022 出自 SK hynix 和 H5CG34MEBDX030 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5CG34MEBDX030 H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 ✓ 量产中

规格对比

参数 H5CG28AGBDX022 H5CG34MEBDX030
品牌 SK hynix SK hynix
分类 Memory ICs DRAM
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $1.00 $5.75
Manufacturer SK hynix SK hynix
Product Family H5CG2 series (DDR5 SDRAM) H5CG (DDR5 SDRAM)
存储器类型 DDR5 SDRAM DDR5 SDRAM
Density [DATA_NEEDED: verified density in Gb] [DATA_NEEDED: device density (Gb)]
存储组织 [DATA_NEEDED: verified organization] [DATA_NEEDED: x organization]
Speed Grade [DATA_NEEDED: verified speed grade] —
Supply Voltage (VDD) 1.1 V (DDR5 class nominal) —
Package Type [DATA_NEEDED: verified package and ball count] —
安装类型 Surface Mount (BGA) Surface Mount
ECC On-die ECC (DDR5 feature) —
Burst Length 16 / 32 (DDR5 feature) 16 (DDR5 standard)
工作温度 [DATA_NEEDED: verified temperature range] [DATA_NEEDED: operating temperature range]
接口 DDR5 synchronous interface —
RoHS 状态 [DATA_NEEDED: verified RoHS status] Compliant
Packing [DATA_NEEDED: verified packing type] —
MSL 等级 [DATA_NEEDED: verified MSL] [DATA_NEEDED: moisture sensitivity level]
Speed Grade / Data Rate — [DATA_NEEDED: MT/s speed bin]
CAS Latency (CL) — [DATA_NEEDED: CL value]
Supply Voltage VDD — [DATA_NEEDED: VDD (typ. 1.1 V class for DDR5)]
封装 — FBGA (fine-pitch BGA), surface mount
On-die ECC — Yes (DDR5 standard feature)
Bank Groups — [DATA_NEEDED: bank group count]
接口类型 — Parallel, DDR5 point-to-point

数据手册与资源

浏览全部产品 创建 BOM 获取报价