H5CG34MEBDX030N vs H5CG34MEBDX030 对比

详细并排对比 H5CG34MEBDX030N 出自 SK hynix 和 H5CG34MEBDX030 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5CG34MEBDX030 H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 ✓ 量产中

规格对比

参数 H5CG34MEBDX030N H5CG34MEBDX030
品牌 SK hynix SK hynix
分类 DDR5 DRAM
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $4.42 $5.75
Manufacturer SK hynix SK hynix
Product Type DDR5 SDRAM Component —
Density 16 Gbit (2 GB) [DATA_NEEDED: device density (Gb)]
Memory Series H5CG3 series (B-die) —
DRAM Process Node 1b-nanometer-class —
Supply Voltage VDD/VDDQ 1.1 V —
Wordline Boost Supply VPP 1.8 V —
接口 DDR5 (JEDEC double data rate 5) —
存储组织 x8 or x16 configuration [DATA_NEEDED: exact bus width] [DATA_NEEDED: x organization]
Data Rate Class [DATA_NEEDED: speed grade per -030 suffix] —
On-Die ECC Yes (DDR5 ODECC) —
Sub-Channel Architecture Dual independent 32/40-bit sub-channels —
Package Type FBGA surface mount —
工作温度 [DATA_NEEDED: commercial/industrial range] [DATA_NEEDED: operating temperature range]
ECC Feature On-die ECC, no host overhead —
Typical Application Server RDIMM / LRDIMM components —
Product Family — H5CG (DDR5 SDRAM)
存储器类型 — DDR5 SDRAM
Speed Grade / Data Rate — [DATA_NEEDED: MT/s speed bin]
CAS Latency (CL) — [DATA_NEEDED: CL value]
Supply Voltage VDD — [DATA_NEEDED: VDD (typ. 1.1 V class for DDR5)]
封装 — FBGA (fine-pitch BGA), surface mount
安装类型 — Surface Mount
On-die ECC — Yes (DDR5 standard feature)
Burst Length — 16 (DDR5 standard)
Bank Groups — [DATA_NEEDED: bank group count]
接口类型 — Parallel, DDR5 point-to-point
RoHS 状态 — Compliant
MSL 等级 — [DATA_NEEDED: moisture sensitivity level]

数据手册与资源

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