H5TC4G63AFR-PBA vs K4B4G1646D-BHMA 对比
详细并排对比 H5TC4G63AFR-PBA 出自 SK hynix 和 K4B4G1646D-BHMA 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | H5TC4G63AFR-PBA | K4B4G1646D-BHMA |
|---|---|---|
| 品牌 | SK hynix | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.98 | $2.90 |
| 存储器类型 | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4Gb | 4 Gb |
| 存储组织 | 256M x 16 | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V | — |
| 数据速率 | 1866 Mbps (PC3L-14900) | 1866 Mbps |
| 封装 | 96-ball FBGA | 96-ball FBGA |
| Ball Pitch | 0.8mm | — |
| Number of Banks | 8 | — |
| Burst Length | 8 and 4 (with burst chop) | 8 and 4 |
| CAS Latency (CL) | 11, 12, 13 | — |
| 工作温度范围 | 0°C to +95°C (Tcase) | — |
| 接口 | 16-bit I/O | — |
| On-Die Termination (ODT) | Yes | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| Auto Self-Refresh | Yes | — |
| Partial Array Self-Refresh | Yes | — |
| RoHS | Compliant | — |
| 电源电压 | — | 1.35 V (1.283 V to 1.45 V) |
| 工作温度 | — | -40°C to +95°C (TC) |
| CAS 延迟 | — | 13 (at 1866 Mbps) |
| Number of Terminals | — | 96 |
| Lead-Free | — | Yes |
| 无卤 | — | Yes |
| RoHS Compliant | — | Yes |
| Die Version | — | D-die |
| Refresh Mode | — | Auto and Self Refresh |