IRFS52N15DTRLP vs IRFS4321TRLPBF 对比

详细并排对比 IRFS52N15DTRLP 出自 Infineon 和 IRFS4321TRLPBF 出自 Infineon。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Infineon
IRFS52N15DTRLP IRFS52N15DTRLP - 150V 51A N-Channel HEXFET MOSFET D2PAK

IRFS52N15DTRLP - 150V 51A N-Channel HEXFET MOSFET D2PAK

IRFS52N15DTRLP ✓ 量产中

规格对比

参数 IRFS52N15DTRLP IRFS4321TRLPBF
品牌 Infineon Infineon
分类 MOSFETs MOSFETs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $1.62 $1.73
FET Type N-Channel MOSFET N-Channel MOSFET, Metal Oxide
Technology HEXFET (Planar) IR HEXFET (IR MOSFET)
Drain-to-Source Voltage (Vdss) 150 V —
Continuous Drain Current (Id) @ TC = 25 C 51 A (Tc) —
Continuous Drain Current (Id) @ TC = 100 C 36 A (Tc, estimated) —
Continuous Drain Current (Id) @ TA = 25 C 60 A (Ta, datasheet) —
On-Resistance Rds(on) max @ VGS = 10 V 32 mOhm —
Gate Threshold Voltage (VGS(th)) 2.0 V to 4.0 V (typical 3 V) —
Total Gate Charge (Qg) [DATA_NEEDED: total gate charge in nC] —
Gate-to-Drain Charge (Qgd) [DATA_NEEDED: Qgd in nC] —
Input Capacitance (Ciss) [DATA_NEEDED: Ciss in pF] —
Power Dissipation (Pd) @ TC = 25 C 230 W (Tc) —
Power Dissipation (Pd) @ TA = 25 C 3.8 W (Ta) —
Thermal Resistance Junction-to-Case (RthJC) [DATA_NEEDED: RthJC in C/W] —
Thermal Resistance Junction-to-Ambient (RthJA) [DATA_NEEDED: RthJA in C/W] —
工作温度范围 -55 C to +175 C (junction) —
封装 D2PAK (TO-263) surface mount TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
安装类型 Surface Mount Surface Mount
引脚数量 3 (Gate, Drain, Source) + tab —
RoHS 状态 Compliant Compliant
Lead-Free Finish Yes (matte tin) —
MSL 等级 1 (per JEDEC J-STD-020, typical for D2PAK) —
Drain-to-Source Voltage (VDS) — 150 V
Continuous Drain Current (ID) at Tc=25C — 85 A
Continuous Drain Current (ID) at Tc=100C — [DATA_NEEDED: ID at Tc=100C]
Pulsed Drain Current (IDM) — [DATA_NEEDED: pulsed drain current]
RDS(on) Max at VGS=10V — 15 mOhm
RDS(on) Max at VGS=4.5V — [DATA_NEEDED: RDS(on) at VGS=4.5V]
Gate-to-Source Voltage (VGS) Max — ±20 V
Gate Threshold Voltage (VGS(th)) Typ — [DATA_NEEDED: VGS(th) typical]
Total Gate Charge (Qg) Typ — 71 nC
Total Gate Charge (Qg) Max — 110 nC
Power Dissipation (PD) at Tc=25C — 350 W
Thermal Resistance Junction-to-Case (RθJC) Max — 0.45 C/W
Thermal Resistance Junction-to-Case (RθJC) End-of-Life — 0.65 C/W (after 1000 cycles -55C to +150C)
工作结温 — -55C to +175C

数据手册与资源

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