K3K8K80BM-JGCT vs K3KCKC0BM-JGCT 对比

详细并排对比 K3K8K80BM-JGCT 出自 Samsung Electronics 和 K3KCKC0BM-JGCT 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K3K8K80BM-JGCT K3K8K80BM-JGCT - Samsung LPDDR DRAM Memory IC | Samsung Electronics

K3K8K80BM-JGCT - Samsung LPDDR DRAM Memory IC | Samsung Electronics

K3K8K80BM-JGCT ✓ 量产中
Samsung Electronics
K3KCKC0BM-JGCT K3KCKC0BM-JGCT - LPDDR5 64Gb DRAM SDRAM | Samsung

K3KCKC0BM-JGCT - LPDDR5 64Gb DRAM SDRAM | Samsung

K3KCKC0BM-JGCT ✓ 量产中

规格对比

参数 K3K8K80BM-JGCT K3KCKC0BM-JGCT
品牌 Samsung Electronics Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $3.10 $0.00
Manufacturer Samsung Electronics —
Product Family K3K mobile DRAM (LPDDR) component series —
存储器类型 Low Power DRAM (LPDDR) component LPDDR5 SDRAM
Density [DATA_NEEDED: die density in Gb] 64 Gb
存储组织 [DATA_NEEDED: x8/x16 organization] [DATA_NEEDED: organization (x32/x16)]
接口 [DATA_NEEDED: LPDDR4X or LPDDR5] LPDDR5 (Low Power Double Data Rate 5)
Maximum Data Rate [DATA_NEEDED: Mbps] —
Supply Voltage (VDD) [DATA_NEEDED: core supply voltage] —
Supply Voltage (VDDQ) [DATA_NEEDED: I/O supply voltage] —
Package Type FBGA (Ball Grid Array) FBGA (fine-pitch ball grid array)
Ball Count [DATA_NEEDED: package ball count] [DATA_NEEDED: ball count]
安装类型 Surface Mount Surface Mount
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Speed Grade Suffix J (per Samsung speed-grade coding) JGCT
Packing Suffix CT (per Samsung packing-code convention) —
RoHS 状态 [DATA_NEEDED: RoHS compliance] unknown
MSL 等级 [DATA_NEEDED: moisture sensitivity level] —
Max Pin Speed (family reference K3LKCKC0BM-MGCP) — 6400 Mbps
Supply Voltage Core (VDD1) — [DATA_NEEDED: VDD1 voltage]
Supply Voltage I/O (VDD2/VDDQ) — [DATA_NEEDED: VDDQ voltage]
Refresh Mode — Self-refresh with partial array self-refresh (PASR)
Power Features — DVFSC, deep power-down
Packaging — [DATA_NEEDED: packing type and standard quantity]

数据手册与资源

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