K3KL3L30CM-BGCU vs K3LK4L40DM-BGCT 对比

详细并排对比 K3KL3L30CM-BGCU 出自 Samsung Electronics 和 K3LK4L40DM-BGCT 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K3KL3L30CM-BGCU K3KL3L30CM-BGCU - 64Gb LPDDR5X DRAM 8533Mbps | Samsung

K3KL3L30CM-BGCU - 64Gb LPDDR5X DRAM 8533Mbps | Samsung

K3KL3L30CM-BGCU ✓ 量产中
Samsung Electronics
K3LK4L40DM-BGCT K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics

K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics

K3LK4L40DM-BGCT ✓ 量产中

规格对比

参数 K3KL3L30CM-BGCU K3LK4L40DM-BGCT
品牌 Samsung Electronics Samsung Electronics
分类 Memory ICs DRAM
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $40.50
存储器类型 LPDDR5X SDRAM (Volatile DRAM) DRAM (SDRAM component)
存储容量 64 Gb (8 GB) —
数据速率 8533 Mbps [DATA_NEEDED: Data Rate]
Memory Organization x64 —
Technology LPDDR5X (JEDEC LPDDR5X-class low-power DRAM) —
封装 FBGA-496 (BGCU) —
安装类型 Surface Mount Surface Mount
Die Configuration Stacked multi-die DRAM —
接口 LPDDR5X (standard LPDDR ball interface) —
Application Segment AI devices and automotive —
Power Efficiency Approx. 25% better than previous LPDDR5 generation (per Samsung) —
Speed Improvement Up to 1.25x faster than previous generation (per Samsung) —
Supply Voltage Class [DATA_NEEDED: VDD/VDDQ voltage] [DATA_NEEDED: Supply Voltage]
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: Operating Temperature Range]
MSL 等级 [DATA_NEEDED: moisture sensitivity level] [DATA_NEEDED: Moisture Sensitivity Level]
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS Status]
Place of Origin (per distributor listing) Johor, Malaysia —
Manufacturer — Samsung Electronics
Density — [DATA_NEEDED: Density]
Organization (x-width) — [DATA_NEEDED: Organization]
CAS 延迟 — [DATA_NEEDED: CAS Latency]
Package Type — BGA (per -BGC ordering-code suffix)
Package Ball Count — [DATA_NEEDED: Ball Count]
Refresh Rate — [DATA_NEEDED: Refresh Interval]
Lead Free — [DATA_NEEDED: Lead-Free Status]
Packaging — Tape & Reel (per -T-style suffix convention) [DATA_NEEDED: confirmed packaging]

数据手册与资源

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