K3KLALA0DM-MGCU vs K3KL8L80DM-JGCT 对比
详细并排对比 K3KLALA0DM-MGCU 出自 Samsung Electronics 和 K3KL8L80DM-JGCT 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K3KLALA0DM-MGCU | K3KL8L80DM-JGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $80.70 |
| 存储器类型 | LPDDR5X SDRAM | — |
| Density | 16 Gbit (2 GB) per die | 32 Gbit (4 GB) |
| Maximum Data Rate | 6400 Mbps per pin | — |
| 接口 | LPDDR5X (LPDDR5X-class channel) | LPDDR5X (JEDEC LPDDR5-compatible, low-power SDRAM) |
| 封装 | 315-ball FBGA | FBGA-315 (315-ball BGA) |
| 存储组织 | [DATA_NEEDED: die organization x16/x32] | x32 |
| Supply Voltage - Core (VDD1) | [DATA_NEEDED: VDD1 voltage] | — |
| Supply Voltage - I/O (VDD2/VDDQ) | [DATA_NEEDED: VDDQ voltage] | — |
| Speed Grade Suffix | MGCU (6400 Mbps class) | — |
| Grade | Mobile / Low Power Mobile Grade | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Ball Pitch | [DATA_NEEDED: ball pitch mm] | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | -25C to +85C |
| Place of Origin | Johor, Malaysia (per distributor listing) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| DRAM Process | Advanced DRAM node (EUV-class per Samsung LPDDR5X family) | — |
| Manufacturer | — | Samsung Electronics |
| Product Type | — | LPDDR5X SDRAM |
| 数据速率 | — | Up to 7500 Mbps (family up to 8.5 Gbps) |
| Supply Rails | — | 500 mV / 900 mV / 1.05 V / 1.8 V |
| Power Efficiency | — | ~20-25% improvement vs LPDDR5 (family figure) |
| Application Domains | — | Mobile, PC, automotive, on-device AI |
| VDD2/VDDQ Class | — | [DATA_NEEDED: exact VDD2 and VDDQ rail values for -JGCT speed grade] |
| Speed Grade Suffix Detail | — | [DATA_NEEDED: official Samsung ordering-code decode for JGCT suffix] |
| Package Dimensions | — | [DATA_NEEDED: package body dimensions in mm] |
| MSL 等级 | — | [DATA_NEEDED: moisture sensitivity level] |