K4A4G165WE-BCTD vs K4A4G165WD-BCRC 对比
详细并排对比 K4A4G165WE-BCTD 出自 Samsung Electronics 和 K4A4G165WD-BCRC 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4A4G165WE-BCTD | K4A4G165WD-BCRC |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | DRAM | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $11.38 | $5.10 |
| 存储器类型 | DDR4 SDRAM (volatile DRAM) | DDR4 SDRAM |
| 存储容量 | 4 Gbit | — |
| Memory Organization | 256M x 16 | — |
| 接口 | Parallel, x16 | — |
| Supply Voltage (VDD) | 1.2 V (1.14 V to 1.26 V) | — |
| Die Generation | E-die | — |
| 封装 | FBGA-96 (TFBGA) | FBGA-96 |
| Terminal Count | 96 | — |
| 工作温度 | 0C to +85C | [DATA_NEEDED: operating temperature range] |
| 安装类型 | Surface Mount | Surface Mount |
| Speed Grade | [DATA_NEEDED: max data rate / CAS latency for -BCTD suffix] | — |
| RoHS 状态 | Compliant (per JLCPCB listing) | Lead free / RoHS Compliant |
| Product Status | Active | — |
| Datasheet Revision | K4A4G165WE Rev. 1.4, Jun. 2016 | — |
| Burst Length | BL8 (JEDEC DDR4) | — |
| Bank Group Architecture | Yes (DDR4) | — |
| Density | — | 4 Gbit |
| 存储组织 | — | 256M x 16 |
| Speed Bin | — | DDR4-2400 (BCRC) |
| 电源电压 | — | 1.2 V |
| Process Generation | — | Samsung D-die |
| 接口类型 | — | DDR4 (double data rate, parallel) |
| On-Die Termination (ODT) | — | Yes |
| Data Mask Function | — | Yes |
| Auto Precharge | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |