K4B4G1646E-BYK000 vs MT41K128M16JT-125:K 对比
详细并排对比 K4B4G1646E-BYK000 出自 Samsung Electronics 和 MT41K128M16JT-125:K 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Micron Technology
MT41K128M16JT-125:K - 2Gb DDR3L SDRAM 1600MT/s | Micron Technology
MT41K128M16JT-125:K ✓ 量产中规格对比
| 参数 | K4B4G1646E-BYK000 | MT41K128M16JT-125:K |
|---|---|---|
| 品牌 | Samsung Electronics | Micron Technology |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.56 | $9.75 |
| 存储器类型 | DDR3L SDRAM | DDR3L SDRAM |
| 存储容量 | 4 Gbit | — |
| 存储组织 | 256M x 16 | 128M x 16 |
| Speed Grade | DDR3-1600 (1.25 ns clock cycle) | — |
| Clock Frequency | 800 MHz | 800 MHz (1600 MT/s data rate) |
| CAS Latency (CL) | [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data] | — |
| Supply Voltage (VDD) | 1.35 V (DDR3L), 1.5 V compatible (DDR3) | 1.35 V (1.283 V to 1.45 V) |
| Number of Banks | [DATA_NEEDED: bank count] | — |
| Die Process | Samsung E-die | — |
| 封装 | 96-FBGA (BYK) | 96-FBGA (8x14 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| 接口 | Parallel | Parallel |
| 工作温度 | [DATA_NEEDED: operating temperature range] | 0C to +95C |
| 特性 | Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| Access Time | 1.25 ns | — |
| Memory Capacity | — | 2 Gbit |
| Access Time (Clock Cycle) | — | 13.75 ns |
| Prefetch Architecture | — | 8n-bit |
| Self Refresh | — | Auto self-refresh |
| Write Leveling | — | Supported |
| Data Mask | — | Supported |
| On-Die Termination | — | Dynamic ODT supported |
| Asynchronous Reset | — | Supported |