K9CHGY8S5C-CCK0 vs K9PRGY8S7M-CCK0 对比

详细并排对比 K9CHGY8S5C-CCK0 出自 Samsung Electronics 和 K9PRGY8S7M-CCK0 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K9CHGY8S5C-CCK0 K9CHGY8S5C-CCK0 - Samsung NAND Flash Memory BGA-316 | Samsung

K9CHGY8S5C-CCK0 - Samsung NAND Flash Memory BGA-316 | Samsung

K9CHGY8S5C-CCK0 ✓ 量产中
Samsung Electronics
K9PRGY8S7M-CCK0 K9PRGY8S7M-CCK0 - Samsung NAND Flash Memory BGA | Samsung

K9PRGY8S7M-CCK0 - Samsung NAND Flash Memory BGA | Samsung

K9PRGY8S7M-CCK0 ✓ 量产中

规格对比

参数 K9CHGY8S5C-CCK0 K9PRGY8S7M-CCK0
品牌 Samsung Electronics Samsung Electronics
分类 Memory ICs EEPROM
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $0.00
Manufacturer Samsung Electronics Samsung Electronics
Product Type NAND Flash Memory —
封装 BGA-316 BGA (surface mount)
存储组织 x8 (8-bit data access), quad CE configuration —
Chip Enable Count 16 (CE_n) —
Pin Reduction Not used —
Supply Rail VCC 1.83 V —
Supply Rail (secondary) 1.84 V —
Supply Rail VCCQ-class 2.96 V —
Program/Erase Supply Rail 12 V domain —
Memory Technology [DATA_NEEDED: cell type / V-NAND generation] —
Density [DATA_NEEDED: total density in Gb] [DATA_NEEDED: density]
接口类型 [DATA_NEEDED: toggle DDR / ONFI, max data rate] —
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: page size]
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
安装类型 Surface Mount (BGA reflow) Surface Mount
RoHS 状态 [DATA_NEEDED: RoHS status] Lead free / RoHS compliant
Program/Erase Cycles [DATA_NEEDED: P/E endurance] [DATA_NEEDED: P/E cycle endurance]
存储器类型 — NAND Flash
Memory Bus Width — [DATA_NEEDED: bus width]
电源电压 — [DATA_NEEDED: supply voltage]
接口 — [DATA_NEEDED: interface type]
Block Size — [DATA_NEEDED: block size]
MSL 等级 — [DATA_NEEDED: moisture sensitivity level]
Package Ball Count — [DATA_NEEDED: BGA ball count]

数据手册与资源

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