K9HQGY8S5M vs K9EUGY8S0M-BCK0 对比

详细并排对比 K9HQGY8S5M 出自 Samsung Electronics 和 K9EUGY8S0M-BCK0 出自 Samsung Electro-Mechanics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K9HQGY8S5M K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M ✓ 量产中
Samsung Electro-Mechanics
K9EUGY8S0M-BCK0 K9EUGY8S0M-BCK0 - Samsung V-NAND Flash Memory | Samsung

K9EUGY8S0M-BCK0 - Samsung V-NAND Flash Memory | Samsung

K9EUGY8S0M-BCK0 ✓ 量产中

规格对比

参数 K9HQGY8S5M K9EUGY8S0M-BCK0
品牌 Samsung Electronics Samsung Electro-Mechanics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $0.00
Manufacturer Samsung Electronics Samsung Electronics
Product Type 3D V-NAND Flash Memory (stacked, client NAND) —
Package Type 316-ball Fine Pitch BGA (FBGA-316) —
Die Configuration 4 x K9ADGD8S0A V-NAND dies (per TechInsights package analysis) —
NAND Technology 32-layer pMLC 3D V-NAND (per Samsung 850 Pro 256 GB analysis) —
Memory Class Non-volatile NAND flash —
接口 NAND (ONFI/Toggle-style asynchronous interface) - exact timing mode [DATA_NEEDED: interface timing mode] —
Density [DATA_NEEDED: total bit density] [DATA_NEEDED: memory density]
电源电压 [DATA_NEEDED: VCC range] [DATA_NEEDED: VCC voltage]
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: block size] [DATA_NEEDED: block size]
Program/Erase Cycles [DATA_NEEDED: P/E endurance rating] —
安装类型 Surface Mount (BGA) Surface Mount
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: temperature range]
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
MSL 等级 [DATA_NEEDED: moisture sensitivity level] —
Original Application Samsung SSD 850 Pro solid-state drive —
Product Family — K9-series V-NAND Flash
存储器类型 — NAND Flash (non-volatile)
存储组织 — [DATA_NEEDED: organization x8/x16]
Cell Type — [DATA_NEEDED: SLC/MLC/TLC/QLC]
VCCQ Voltage — [DATA_NEEDED: VCCQ voltage]
Access Time (tR) — [DATA_NEEDED: read access time]
Program Time (tPROG) — [DATA_NEEDED: program time]
Erase Time (tBERS) — [DATA_NEEDED: block erase time]
Endurance — [DATA_NEEDED: program/erase cycles]
封装 — [DATA_NEEDED: package type and dimensions]
Packing — [DATA_NEEDED: tray or tape and reel]

数据手册与资源

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