LPC1823JET100E vs LPC1812JET100E 对比
详细并排对比 LPC1823JET100E 出自 NXP Semiconductors 和 LPC1812JET100E 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | LPC1823JET100E | LPC1812JET100E |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| Product Type | 32-bit microcontroller | 32-bit ARM Cortex-M3 microcontroller |
| Processor Core | Arm Cortex-M3 | — |
| Maximum CPU Frequency | 180 MHz | 180 MHz |
| Flash Memory | 512 kB | 512 KB |
| SRAM | 104 kB | 104 KB |
| Architecture | 32-bit | ARM Cortex-M3 |
| Program Memory Type | Flash | — |
| 封装 | 100-ball TFBGA, 9 x 9 mm | TFBGA-100, 9 mm x 9 mm |
| 安装类型 | Surface mount | Surface mount |
| Product Variant | LPC1823JET100E | — |
| Core Variant | LPC18xx | — |
| Manufacturer | NXP Semiconductors | — |
| Operating Voltage Range | [DATA_NEEDED: operating voltage range] | — |
| Number of I/O Pins | [DATA_NEEDED: number of I/O pins] | — |
| 工作温度范围 | [DATA_NEEDED: operating temperature range] | -40 °C to +105 °C |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | [DATA_NEEDED: AEC-Q100 qualification] |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | [DATA_NEEDED: halogen-free status] |
| Bit Width | — | 32 bit |
| Package Type | — | Thin Flip-Ball Grid Array |
| Ball Count | — | 100 balls |
| Core | — | Arm Cortex-M3 |
| Manufacturer Product Page | — | LPC1812JET100 |
| Maximum Supply Voltage | — | [DATA_NEEDED: maximum supply voltage] |
| I/O Pin Count | — | [DATA_NEEDED: usable I/O pin count] |
| Ethernet Support | — | [DATA_NEEDED: Ethernet controller configuration] |
| USB Support | — | [DATA_NEEDED: USB controller configuration] |