M1AFS250-1FGG256I vs M1AFS250-FGG256I 对比

详细并排对比 M1AFS250-1FGG256I 出自 Microchip Technology 和 M1AFS250-FGG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ 量产中
Microchip Technology
M1AFS250-FGG256I M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip

M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip

M1AFS250-FGG256I ✓ 量产中

规格对比

参数 M1AFS250-1FGG256I M1AFS250-FGG256I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $49.50
Series M1AFS250 (Fusion) Fusion (M1AFS)
System Gates 250,000 gates 250K
Logic Cells 6144 —
Total SRAM/Flip-Flop Bits (DigiKey listing) 36864 —
Number of I/O 114 —
Maximum System Frequency 350 MHz —
Processor Core ARM Cortex-M1 (optional ARM support, M1 variant) —
Technology 130-nm, 7-layer metal, flash-based CMOS —
Configuration Memory Nonvolatile flash (Live at Power-Up, LAPU) On-chip flash (non-volatile)
Security 128-bit flash-based lock, AES decryption —
工作电源电压 1.5 V —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
封装 / 外壳 256-LBGA (FBGA), 1.00 mm ball pitch —
安装方式 SMD/SMT —
Packaging Tray Tray
Mixed-Signal Features Configurable analog, flash memory blocks, clock generation and management —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
D Flip-Flops / Registers — 36864
User I/O — 114
Embedded Processor — ARM Cortex-M1
Core Supply Voltage — 1.5 V
Fabric Speed Metric — 1.0989 GHz (per distributor listing)
Process Technology — 130 nm flash-based
封装 — 256-LBGA (FGG256)
Ball Pitch — 1.0 mm
安装类型 — Surface Mount
工作温度 — -40C to +85C (Industrial)

数据手册与资源

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