M1AFS250-FG256 vs M1AFS250-1FGG256I 对比
详细并排对比 M1AFS250-FG256 出自 Microchip Technology 和 M1AFS250-1FGG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
M1AFS250-FG256 - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-FG256 ✓ 量产中Microchip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ 量产中规格对比
| 参数 | M1AFS250-FG256 | M1AFS250-1FGG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $112.00 | $0.00 |
| Manufacturer Part Number | M1AFS250-FG256 | — |
| Family | Fusion (M1 series, ARM Cortex-M1) | — |
| System Gates | 250000 | 250,000 gates |
| Logic Cells | 6144 | 6144 |
| Embedded Processor | ARM Cortex-M1 | — |
| 最大时钟频率 | 350 MHz | — |
| Number of I/O | 114 | 114 |
| RAM Bits | 36864 | — |
| Process Technology | 130 nm | — |
| Core Supply Voltage | 1.5 V | — |
| Configuration Memory | Flash (nonvolatile) | Nonvolatile flash (Live at Power-Up, LAPU) |
| 工作温度范围 | 0C to +70C | — |
| 封装 / 外壳 | 256-FBGA (256-LBGA), 1.00 mm pitch | 256-LBGA (FBGA), 1.00 mm ball pitch |
| 安装方式 | SMD/SMT | SMD/SMT |
| Packaging | Tray | Tray |
| RoHS 状态 | RoHS Non-Compliant (contains lead) | [DATA_NEEDED: RoHS status] |
| Lead Free Status | Contains Lead | — |
| Series | M1AFS250 | M1AFS250 (Fusion) |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Security | — | 128-bit flash-based lock, AES decryption |
| 工作电源电压 | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |