M1AFS600-1FGG256 vs M7AFS600-FGG256I 对比
详细并排对比 M1AFS600-1FGG256 出自 Microchip Technology 和 M7AFS600-FGG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip
M1AFS600-1FGG256 ✓ 量产中Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ 量产中规格对比
| 参数 | M1AFS600-1FGG256 | M7AFS600-FGG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $191.10 | $0.00 |
| Family | Fusion Mixed-Signal FPGA | Fusion Mixed-Signal FPGA |
| Processor Core | ARM Cortex-M1 (hard core) | — |
| System Gates | 600000 | 600K |
| Configurable Logic Blocks (CLBs) | 13824 | — |
| Flip-Flops | 110592 | — |
| User I/O | 119 | 119 |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm CMOS, flash-based | 130 nm |
| Configuration Memory | Flash (non-volatile, live at power-up) | — |
| 工作温度 | 0C to +85C | — |
| 封装 | 256-ball LBGA (FGG256), 17x17x1.7 mm | 256-LBGA (FBGA), 1 mm ball pitch |
| 安装类型 | Surface Mount | Surface Mount |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| RoHS 状态 | Compliant | — |
| Packaging | Tray | Tray |
| Core Voltage | — | 1.5 V |
| Maximum System Frequency | — | 1098.9 MHz (per distributor parametric listing) |
| Embedded Processor | — | ARM CoreMP7 |
| Fabric Type | — | Flash-based, non-volatile, instant-on |
| Analog Subsystem | — | Integrated configurable analog (per Microchip Fusion family page) |
| On-chip Flash Memory | — | Yes (large flash memory blocks, per Microchip Fusion family page) |
| Clock Management | — | Integrated clock generation and management circuitry (PLLs) |
| Temperature Grade | — | Industrial (I suffix) |
| 工作温度范围 | — | -40C to +85C (industrial grade standard range) |
| MSL 等级 | — | [DATA_NEEDED: MSL Level] |
| Thermal Resistance (theta_JA) | — | [DATA_NEEDED: Thermal Resistance] |