M7AFS600-1FGG256I vs M7AFS600-FGG256 对比
详细并排对比 M7AFS600-1FGG256I 出自 Microchip Technology 和 M7AFS600-FGG256 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ 量产中Microchip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ 量产中规格对比
| 参数 | M7AFS600-1FGG256I | M7AFS600-FGG256 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $232.40 |
| Family | Fusion (Mixed-Signal Flash FPGA) | Fusion (M7AFS600) |
| System Gates | 600K | 600K |
| Processor Core | ARM CoreMP7 | — |
| Number of I/O | 119 | — |
| 工作电源电压 | 1.5 V | — |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | 130 nm flash-based |
| Configuration Memory | Flash (nonvolatile) | Flash (single-chip, non-volatile) |
| System Performance | Up to 350 MHz | — |
| Speed Grade | -1 | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| 封装 / 外壳 | 256-Ball FBGA (FGG256) | — |
| 安装方式 | SMD/SMT | — |
| Packaging | Tray | Tray |
| Series | M7AFS600 | — |
| Live at Power-Up (LAPU) | Yes | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Analog Subsystem | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) | — |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Maximum Frequency | — | 1098.9 MHz (distributor listing) |
| 封装 | — | 256-LBGA / 256-FBGA |
| Ball Pitch | — | 1 mm |
| 安装类型 | — | Surface Mount |
| Analog Features | — | Integrated configurable analog blocks, clock generation and management |
| 工作温度 | — | [DATA_NEEDED: Operating Temperature Range] |
| MSL 等级 | — | [DATA_NEEDED: Moisture Sensitivity Level] |