M7AFS600-2FGG484 vs M7AFS600-1FGG484I 对比

详细并排对比 M7AFS600-2FGG484 出自 Microchip Technology 和 M7AFS600-1FGG484I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
M7AFS600-2FGG484 M7AFS600-2FGG484 - Fusion FPGA 600K Gates | Microchip Technology

M7AFS600-2FGG484 - Fusion FPGA 600K Gates | Microchip Technology

M7AFS600-2FGG484 ✓ 量产中
Microchip Technology
M7AFS600-1FGG484I M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip

M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip

M7AFS600-1FGG484I ✓ 量产中

规格对比

参数 M7AFS600-2FGG484 M7AFS600-1FGG484I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $210.00 $228.00
Family Fusion —
System Gates 600K 600000
Number of I/Os 172 172
Number of Logic Elements 110592 —
Core Voltage 1.5V —
Maximum Operating Frequency 1470.59 MHz 1282.05 MHz
Process Technology 130nm 130 nm
封装 484-BGA (FBGA) —
Package Pitch 1mm —
安装类型 Surface Mount —
工作温度范围 0°C to +85°C —
Flash Memory 110,592 bits —
Embedded Analog Yes (ADC, DAC, comparators) —
RoHS 状态 Compliant ROHS3 Compliant
电源电压 1.5V 1.5 V
Series — Fusion (M7AFS600)
Total RAM Bits — 110592
Embedded Processor — ARM CoreMP7
Supply Voltage Range — 1.425 V to 1.575 V
Speed Grade — 1 (M7, fastest family grade)
工作温度 — -40C to +85C
封装 / 外壳 — 484-BGA (FBGA)
Supplier Device Package — 484-FPBGA (23x23)
安装方式 — SMD/SMT
Packaging — Tray
Programmable Type — Flash-based, In-System Programmable
Manufacturer Lead Time — 16 weeks
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]
Number of Logic Cells — [DATA_NEEDED: logic cell count]

数据手册与资源

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