M7AFS600-FG256I vs A3P600-FG256 对比

详细并排对比 M7AFS600-FG256I 出自 Microchip Technology 和 A3P600-FG256 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 量产中
Microchip Technology
A3P600-FG256 A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip

A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip

A3P600-FG256 ✓ 量产中

规格对比

参数 M7AFS600-FG256I A3P600-FG256
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $48.90
Series M7AFS600 (Fusion) —
System Gates 600K 600000
Logic Capacity (DigiKey listing) 110592 —
Number of I/O 119 I/O —
Embedded Processor ARM CoreMP7 —
Core Supply Voltage 1.5 V 1.425 V to 1.575 V (1.5 V nominal)
Process Technology 130 nm 130-nm, 7-layer metal (6 copper), flash-based CMOS
封装 / 外壳 256-LBGA (FBGA) —
Terminal Form Ball —
Package Shape Square —
安装方式 SMD/SMT —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Packaging Tray Tray
Programmable Logic Type Flash-based, non-volatile —
Analog Integration Mixed-signal (configurable analog + flash memory) —
Family — ProASIC3 (Flash FPGAs)
Logic Elements — 7K LEs (VersaTiles)
Embedded SRAM — 110592 bits (True Dual-Port)
User I/O — 177
Maximum System Performance — Approx. 231 MHz
Configuration Technology — On-chip flash, reprogrammable, single-chip
Power-Up Behavior — Instant On Level 0 support
封装 — 256-LBGA / FBGA (17x17 mm, 1 mm pitch)
安装类型 — Surface Mount
工作温度 — 0 C to 85 C (TJ)
I/O Banks — 4 (independent VCCIBx supplies)
RoHS 状态 — RoHS non-compliant (per Microchip USA listing)
Manufacturer Lead Time — 8 weeks

数据手册与资源

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