M7AFS600-FG256I vs AFS600-2FGG256 对比
详细并排对比 M7AFS600-FG256I 出自 Microchip Technology 和 AFS600-2FGG256 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ 量产中
规格对比
| 参数 | M7AFS600-FG256I | AFS600-2FGG256 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Series | M7AFS600 (Fusion) | — |
| System Gates | 600K | Approximately 600,000 gates |
| Logic Capacity (DigiKey listing) | 110592 | — |
| Number of I/O | 119 I/O | 119 I/O |
| Embedded Processor | ARM CoreMP7 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm CMOS |
| 封装 / 外壳 | 256-LBGA (FBGA) | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| 安装方式 | SMD/SMT | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Packaging | Tray | Tray |
| Programmable Logic Type | Flash-based, non-volatile | — |
| Analog Integration | Mixed-signal (configurable analog + flash memory) | — |
| Product Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Blocks | — | 13,824 CLBs |
| Reported Logic Elements | — | 7,000 LE |
| 封装 | — | 256-LBGA |
| Package Pin Count | — | 256 balls |
| Package Pitch | — | 1.0 mm |
| 工作电源电压 | — | 1.5 V |
| 工作温度 | — | 0°C to +70°C |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Nonvolatile flash |
| Power-Up Feature | — | Live at Power-Up |
| Maximum DDR Data Rate | — | 700 Mbps |
| I/O Features | — | Hot-swappable I/O, programmable slew rate, programmable drive strength, weak pull-up/pull-down |
| 安装类型 | — | SMD/SMT |
| RoHS 状态 | — | RoHS compliant |
| Lead-Free Status | — | Lead free |