M7AFS600-FG256I vs M7AFS600-FGG256 对比

详细并排对比 M7AFS600-FG256I 出自 Microchip Technology 和 M7AFS600-FGG256 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 量产中
Microchip Technology
M7AFS600-FGG256 M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip

M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip

M7AFS600-FGG256 ✓ 量产中

规格对比

参数 M7AFS600-FG256I M7AFS600-FGG256
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $232.40
Series M7AFS600 (Fusion) —
System Gates 600K 600K
Logic Capacity (DigiKey listing) 110592 —
Number of I/O 119 I/O —
Embedded Processor ARM CoreMP7 ARM CoreMP7
Core Supply Voltage 1.5 V 1.5 V
Process Technology 130 nm 130 nm flash-based
封装 / 外壳 256-LBGA (FBGA) —
Terminal Form Ball —
Package Shape Square —
安装方式 SMD/SMT —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Packaging Tray Tray
Programmable Logic Type Flash-based, non-volatile —
Analog Integration Mixed-signal (configurable analog + flash memory) —
Family — Fusion (M7AFS600)
Flip-Flops — 110592
User I/O — 119
Maximum Frequency — 1098.9 MHz (distributor listing)
封装 — 256-LBGA / 256-FBGA
Ball Pitch — 1 mm
安装类型 — Surface Mount
Configuration Memory — Flash (single-chip, non-volatile)
Analog Features — Integrated configurable analog blocks, clock generation and management
工作温度 — [DATA_NEEDED: Operating Temperature Range]
RoHS 状态 — [DATA_NEEDED: RoHS Status]
MSL 等级 — [DATA_NEEDED: Moisture Sensitivity Level]

数据手册与资源

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