M7AFS600-FGG484 vs M7AFS600-1FG484I 对比
详细并排对比 M7AFS600-FGG484 出自 Microchip Technology 和 M7AFS600-1FG484I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
M7AFS600-FGG484 - 600K Gate Fusion FPGA, 484-BGA | Microchip
M7AFS600-FGG484 ✓ 量产中Microchip Technology
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
M7AFS600-1FG484I ✓ 量产中规格对比
| 参数 | M7AFS600-FGG484 | M7AFS600-1FG484I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $232.90 | $198.00 |
| Family | Fusion (Mixed-Signal FPGA) | Fusion (Flash FPGA with optional ARM CoreMP7 support) |
| System Gates | 600 K | 600000 |
| Embedded Processor | ARM CoreMP7 (hard core) | — |
| Technology | 130 nm flash-based | — |
| Core Voltage | 1.5 V | — |
| User I/O | 172 | 172 |
| Maximum Operating Frequency | 1098.9 MHz (distributor-listed) | — |
| Configuration Memory | Flash (non-volatile, secure) | Nonvolatile Flash, retains program when powered off |
| 封装 | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm |
| Ball Pitch | 1 mm | 1.0 mm |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| RoHS 状态 | Compliant (Pb-free balls, FGG suffix) | Compliant |
| 工作温度 | [DATA_NEEDED: operating temperature range for commercial grade] | Industrial, -40C to +85C |
| Total RAM Bits | 110592 (per DigiKey listing) | — |
| Number of Logic Blocks | [DATA_NEEDED: logic block count] | — |
| Programmable Logic Tiles | — | 110592 |
| Process Technology | — | 130 nm, 7-layer metal, Flash-based CMOS |
| Power-Up Feature | — | Live at Power-Up (LAPU) |
| Supply Voltage (Core) | — | 1.5 V |
| Logic Family | — | CMOS |
| Speed Grade | — | 1 |
| Embedded Processor Support | — | ARM CoreMP7 |