MAX174ACWI vs MX574ALP+T 对比
详细并排对比 MAX174ACWI 出自 Analog Devices 和 MX574ALP+T 出自 Maxim Integrated。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MAX174ACWI | MX574ALP+T |
|---|---|---|
| 品牌 | Analog Devices | Maxim Integrated |
| 分类 | ADC/DAC | ADC/DAC |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $12.25 | $10.10 |
| 分辨率 | 12 bits | 12 bits |
| Converter Type | SAR (Successive Approximation) | — |
| Number of Input Channels | 1 | — |
| Maximum Sampling Rate | 125 ksps | — |
| Maximum Conversion Time | 8 µs | — |
| Input Voltage Range (Bipolar) | ±5 V or ±10 V | — |
| Supply Voltage (Digital) | 5 V | — |
| Supply Voltage (Analog) | ±12 V or ±15 V | — |
| Internal Reference | 10.000 V buried-Zener | Yes - precision buried zener, 10 ppm/°C (max drift) |
| Analog Input Impedance | 4 kΩ minimum | — |
| Output Interface | Three-state parallel (8/16-bit compatible) | — |
| 工作温度 | 0 °C to +70 °C (commercial, -AC suffix) | 0 °C to +70 °C (commercial) |
| 封装 | 28-pin SOIC (Wide) | 28-PLCC (11.51 x 11.51 mm), J-bend, QCCJ form |
| 安装类型 | Surface Mount | Surface Mount (PLCC socket or hand-solder) |
| Power Dissipation | 100 mW typical during conversion | — |
| Architecture | — | Successive Approximation (SAR) |
| Number of Channels | — | 1 |
| Conversion Method | — | SAR with internal track/hold |
| Input Type | — | Single-ended, software-strapped bipolar/unipolar |
| 输入电压范围 | — | 0 to +10 V, 0 to +20 V, ±5 V, ±10 V (strap-selectable) |
| Conversion Time | — | up to 25 µs (max) |
| Throughput Rate | — | up to ~40 kSPS at 12 bits |
| Data Interface | — | Parallel (12-bit word) |
| 电源电压 | — | +12 V / -12 V / +5 V (analog and digital) |
| Analog Input Current | — | [DATA_NEEDED: input current spec] |
| Integral Non-Linearity (INL) | — | [DATA_NEEDED: INL spec] |
| RoHS 状态 | — | Compliant |
| Process Technology | — | BICMOS |