MC56F8365VFGE vs MC56F8165VFGE 对比

详细并排对比 MC56F8365VFGE 出自 NXP Semiconductors 和 MC56F8165VFGE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC56F8365VFGE MC56F8365VFGE - 16-bit DSC, 56800E Core, 512KB Flash, 60MHz | NXP

MC56F8365VFGE - 16-bit DSC, 56800E Core, 512KB Flash, 60MHz | NXP

MC56F8365VFGE ✗ 停产
NXP Semiconductors
MC56F8165VFGE MC56F8165VFGE - 16-bit DSC, 512KB Flash, 40MHz | NXP

MC56F8165VFGE - 16-bit DSC, 512KB Flash, 40MHz | NXP

MC56F8165VFGE ✓ 量产中

规格对比

参数 MC56F8365VFGE MC56F8165VFGE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 停产 有效
库存状态 有库存 有库存
单价(USD) $42.97 $13.40
Core Architecture 56800E (Harvard, 16-bit DSC) 56800E 16-bit DSC
数据总线宽度 16 bit —
Program Memory (Flash) 512 KB (256K x 16) 512 KB (256K x 16)
RAM 32 KB —
Maximum CPU Clock 60 MHz —
ADC Dual 12-bit, up to 8 channels each [DATA_NEEDED: total ADC channel count] Dual 12-bit [DATA_NEEDED: number of channels and sample rate confirm]
PWM Modules Up to 6 PWM with 12 outputs [DATA_NEEDED: exact PWM count] Yes (motor-control optimized) [DATA_NEEDED: channel count and resolution confirm]
CAN 1 x CAN 2.0 A/B —
SCI (UART) 2 x SCI —
SPI 1 x SPI —
I2C 1 x I2C —
GPIO [DATA_NEEDED: GPIO count] —
封装 128-LQFP (14x20 mm) —
安装类型 Surface Mount Surface Mount
工作温度 [DATA_NEEDED: operating temperature range] —
电源电压 3.3 V 3.0 V to 3.6 V [DATA_NEEDED: core/IO rail confirm]
RoHS 状态 [DATA_NEEDED: RoHS compliance status] Compliant
RAM Size — 16K x 16
Maximum Core Clock — 40 MHz
Number of I/O Pins — 49
封装 / 外壳 — 128-LQFP (14x20 mm)
Oscillator Type — External
工作温度范围 — -40C to +105C [DATA_NEEDED: industrial grade range confirm]
Communication Interfaces — SCI, SPI, I2C, JTAG/OnCE
Timers — 16-bit [DATA_NEEDED: count confirm]
Packaging — Tray
无卤 — Compliant per GlobalSpec cross-reference record

数据手册与资源

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