MC7447AVU1000NB vs MC7447AVU733NB 对比

详细并排对比 MC7447AVU1000NB 出自 NXP Semiconductors 和 MC7447AVU733NB 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC7447AVU1000NB MC7447AVU1000NB - 1GHz PowerPC G4 MPU 512KB L2 | NXP

MC7447AVU1000NB - 1GHz PowerPC G4 MPU 512KB L2 | NXP

MC7447AVU1000NB ⚠ 最后一次采购
NXP Semiconductors
MC7447AVU733NB MC7447AVU733NB - PowerPC G4 MPU 733MHz 360-FCCBGA | NXP

MC7447AVU733NB - PowerPC G4 MPU 733MHz 360-FCCBGA | NXP

MC7447AVU733NB ⚠ 最后一次采购

规格对比

参数 MC7447AVU1000NB MC7447AVU733NB
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $99.50 $72.00
Core Architecture PowerPC G4 (MPC7447A) —
Instruction Set 32-bit PowerPC RISC —
Core Frequency 1.0 GHz —
Bus Width 64-bit external bus —
L1 Cache 32 KB instruction + 32 KB data —
L2 Cache 512 KB on-chip —
SIMD Engine AltiVec (128-bit VMX) —
Number of Cores 1 1
Core Supply Voltage (Vdd) 1.25 V to 1.35 V —
I/O Supply Voltage 1.8 V / 2.5 V 2.5 V
Process Technology Silicon-on-Insulator (SOI), 0.13 um 0.13 um silicon-on-insulator (SOI)
工作温度 0C to +105C (commercial) [DATA_NEEDED: operating temperature range]
封装 360-FCCBGA (Flip-Chip Ceramic BGA), 25x25 mm 360-FCCBGA (25x25 mm)
安装类型 Surface Mount (BGA socket or solder) Surface Mount (Flip-Chip BGA)
RoHS 状态 [DATA_NEEDED: explicit RoHS statement] [DATA_NEEDED: RoHS compliance]
Multi-Core Support Single core (no SMP fabric on-package) —
Floating Point Unit Double-precision FPU + AltiVec single-precision SIMD —
Instruction Cache 32 KB (Harvard) —
Branch Target Buffer 512-entry BHT —
Core Processor — PowerPC G4 (MPC74xx)
Architecture — RISC, 32-bit
Speed (Clock Frequency) — 733 MHz
On-Chip L2 Cache — 512 KB
External Bus Width — 64-bit MPX bus
Vector Engine — AltiVec 128-bit SIMD
Core Supply Voltage — 1.8 V
Co-Processor / DSP — Multimedia; SIMD (AltiVec)
Graphics Acceleration — No
Tray Packaging — Yes (Tray)
Lead-Free (Pb-Free) — Yes (per datasheet A7PM PB-FREE marking)

数据手册与资源

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