MC8640DTHX1067NE vs MC8640DTVJ1067NE 对比
详细并排对比 MC8640DTHX1067NE 出自 NXP Semiconductors 和 MC8640DTVJ1067NE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC8640DTHX1067NE - Dual-Core PowerPC e600 SoC, 2x1067MHz | NXP
MC8640DTHX1067NE ⚠ 最后一次采购
规格对比
| 参数 | MC8640DTHX1067NE | MC8640DTVJ1067NE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $185.25 | $295.00 |
| Core Architecture | PowerPC e600 (dual-core) | PowerPC e600 (dual-core) |
| Number of Cores | 2 | — |
| Core Frequency | 1.067 GHz per core (2x1067 MHz) | 2 x 1067 MHz (1.067 GHz) |
| SIMD Engine | AltiVec | AltiVec |
| Data Width | 32-Bit | — |
| Core Voltage | 0.95 V | — |
| Memory Controller | DDR1/DDR2 with ECC | Dual-channel DDR1/DDR2 with ECC |
| Ethernet | Dual integrated GbE MACs | 2 x 10/100/1000 Mbps (GbE, SGMII) |
| PCI Express | Integrated multi-lane PCIe | 2 x PCIe Gen1 |
| Serial RapidIO | Integrated SRIO | 2 x SRIO |
| Die Revision | Rev 3.0 (G8 stepping) | — |
| 封装 | 1023-ball FCBGA (33x33 mm) | 1023-ball FCCBGA, 33 x 33 mm |
| 工作温度 | -40C to +105C (Industrial) | -40C to +105C |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Product Type | — | 32-Bit Power Architecture SoC (Dual-Core MPU) |
| Silicon Revision | — | Rev 3 |
| Supply Voltages | — | 1.05V core / 1.8V DDR / 2.5V-3.3V I/O |
| Compliance / Status | — | End-of-Life per NXP PCN |