MC9S08AC60CPUE vs MC9S08DN60MLF 对比
详细并排对比 MC9S08AC60CPUE 出自 NXP Semiconductors 和 MC9S08DN60MLF 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S08DN60MLF - 40MHz 8-Bit 60KB MCU | NXP
MC9S08DN60MLF [data_needed: lifecycle status]规格对比
| 参数 | MC9S08AC60CPUE | MC9S08DN60MLF |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | [DATA NEEDED: Lifecycle Status] |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $0.00 |
| Product Type | 8-bit automotive microcontroller (MCU) | 8-bit HCS08 embedded microcontroller |
| CPU Core | HCS08/S08 | — |
| Maximum Clock Speed | 40 MHz | — |
| Flash Memory | 60 KB | — |
| Program Memory Organization | 60K × 8 bits | — |
| RAM | 2 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| ADC Resolution | 10 bits | 12-bit |
| ADC Channel Count | Up to 16 channels | — |
| I/O Port Count | 38 | — |
| SCI Modules | 2 | — |
| Serial Protocol Support | LIN 2.0 and SAE J2602 | — |
| SPI Module | 1 | — |
| IIC Module | 1 | — |
| 封装 | 64-LQFP, 10 mm × 10 mm | 48-LQFP (7x7 mm) |
| 安装类型 | Surface mount | Surface-mount gull-wing package |
| RoHS 状态 | RoHS compliant | [DATA_NEEDED: RoHS status] |
| 生命周期状态 | NRND | — |
| Program Memory Size | — | 60 KB (60K x 8) flash |
| RAM Size | — | 2 KB (2K x 8) |
| CPU Speed | — | 40 MHz |
| Bus Speed | — | 20 MHz |
| Architecture | — | HCS08 CPU with HC08 instruction set and BGND instruction |
| Number of I/O | — | 39 |
| ADC Channels | — | 16 channels |
| ADC Conversion Time | — | 2.5 microseconds |
| Oscillator Type | — | External oscillator |
| Interrupt/Reset Sources | — | Up to 32 interrupt/reset sources |
| Temperature Grade | — | Automotive |
| Packaging | — | Tray |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |
| CAN Controller | — | No CAN |
| Flash Read/Program/Erase | — | Supported over full operating voltage and temperature |