MC9S08AW32CFGE vs MC9S08SV8CBM 对比
详细并排对比 MC9S08AW32CFGE 出自 NXP Semiconductors 和 MC9S08SV8CBM 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08AW32CFGE | MC9S08SV8CBM |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2.86 | $1.65 |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-bit | — |
| Maximum CPU Frequency | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 32 KB (32K x 8) | — |
| RAM | 2 KB | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | 8-channel | — |
| General Purpose I/O | 34 | — |
| 封装 | 44-LQFP (10x10 mm), 0.5 mm pitch | — |
| Package Standard | MO-220VKKD-2, 7 x 7 mm body variants per distributor listing | — |
| 安装类型 | Surface Mount | Through-Hole (DIP) |
| Debug Interface | Single-wire background debug mode (BDM) | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | — |
| 生命周期状态 | NRND (Not Recommended for New Designs) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Product Type | — | 8-bit Microcontroller (MCU) |
| Core | — | HCS08 (HC08 instruction set) |
| Program Memory (Flash) | — | 8 KB (8K x 8) |
| RAM Size | — | 768 x 8 (768 bytes) |
| CPU Speed | — | 40 MHz (max bus clock) |
| Number of I/O | — | 30 |
| 封装 / 外壳 | — | 32-SDIP (0.400", 10.16 mm) |
| Oscillator Type | — | Internal |
| 工作电源电压 | — | 2.7 V to 5.5 V |
| 工作温度范围 | — | -40C to +85C |
| Data Converters | — | [DATA_NEEDED: ADC channels and resolution] |
| Connectivity | — | [DATA_NEEDED: SCI/SPI/I2C instance count] |
| Peripherals | — | [DATA_NEEDED: timers, watchdog, LVD list] |
| Packaging | — | Tube |
| MSL 等级 | — | [DATA_NEEDED: moisture sensitivity level] |