MC9S08AW60CFGE vs MC9S08AW16CFGE 对比
详细并排对比 MC9S08AW60CFGE 出自 NXP Semiconductors 和 MC9S08AW16CFGE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP
MC9S08AW16CFGE Nrnd规格对比
| 参数 | MC9S08AW60CFGE | MC9S08AW16CFGE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $0.00 |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 (HCS08) |
| Core Size | 8-Bit | 8-bit |
| Maximum CPU Frequency | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 60 KB (60K x 8) | 16KB (16K x 8) |
| RAM Size | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) | [DATA_NEEDED: RAM size] |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 general-purpose I/O | — |
| ADC Resolution | 10-bit, 8-channel | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| 封装 | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | — |
| 安装类型 | Surface Mount | Surface Mount |
| Supply Voltage Nominal | 3.3 V / 5 V | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Packaging | Tray | — |
| 生命周期状态 | NRND (Not Recommended for New Designs) per NXP | — |
| Family | MC9S08AW (S08AW series) | S08AW (AW60/AW48/AW32/AW16) |
| CPU Speed | — | 40 MHz |
| Architecture | — | CISC, HC08 instruction set with added BGND instruction |
| I/O Ports | — | 38 general-purpose I/O |
| Package Type | — | 44-LQFP (10x10 mm) |
| Package Outline | — | QFNL, MO-220VKKD-2, 0.50 mm pitch, 1 mm height |
| Target Industries | — | Industrial and Automotive |
| Lifecycle Status (NXP) | — | NRND (Not Recommended for New Designs) |
| RoHS 状态 | — | [DATA_NEEDED: RoHS status] |