MC9S08AW60CFGE vs MC9S08SE8VWL 对比
详细并排对比 MC9S08AW60CFGE 出自 NXP Semiconductors 和 MC9S08SE8VWL 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S08SE8VWL - 8-Bit S08 MCU, 8KB Flash, 20MHz, 28-SOIC | NXP
MC9S08SE8VWL ⚠ 最后一次采购规格对比
| 参数 | MC9S08AW60CFGE | MC9S08SE8VWL |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $2.34 |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Maximum CPU Frequency | 40 MHz | 20 MHz |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| I/O Count | 38 general-purpose I/O | — |
| ADC Resolution | 10-bit, 8-channel | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BDM) | Background Debug Mode (BDM), single-wire |
| 封装 | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | 28-SOIC (W, wide-body) |
| 安装类型 | Surface Mount | Surface Mount |
| Supply Voltage Nominal | 3.3 V / 5 V | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | -40 C to +105 C (industrial) |
| Packaging | Tray | — |
| 生命周期状态 | NRND (Not Recommended for New Designs) per NXP | — |
| Family | MC9S08AW (S08AW series) | — |
| Core | — | S08 (HCS08) 8-bit CISC |
| Program Flash Memory | — | 8 KB (8K x 8) |
| RAM | — | 1 KB |
| EEPROM | — | 512 bytes |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Supply Voltage (datasheet rating) | — | 3.3 V / 5 V dual-rail |
| ADC | — | 8-channel, 12-bit (10-bit mode) |
| Timers (TPM) | — | 2 x 16-bit |
| Communication Interfaces | — | 1 x SCI (UART), 1 x SPI, 1 x I2C |
| GPIO | — | Up to 24 shared with peripherals |
| Low-Voltage Detect | — | Yes (LVD module) |
| RoHS 状态 | — | Compliant |
| MSL 等级 | — | MSL3 (JEDEC J-STD-020) |