MC9S08DN60ACLH vs MC9S08MM32CLH 对比
详细并排对比 MC9S08DN60ACLH 出自 NXP Semiconductors 和 MC9S08MM32CLH 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08DN60ACLH | MC9S08MM32CLH |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5.21 | $3.32 |
| Core | HCS08 (S08 core) | — |
| 数据总线宽度 | 8 bit | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM Size | 2 KB (2K x 8) | 2 KB |
| EEPROM | Embedded (size [DATA_NEEDED: EEPROM size]) | — |
| Number of I/O | 53 | 56 (approximate, GPIO capable) |
| 封装 / 外壳 | 64-LQFP (10x10 mm) | — |
| 安装类型 | Surface Mount | Surface Mount |
| ADC | 16-channel, 12-bit, 2.5 us conversion | — |
| Communication Interfaces | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C | — |
| Oscillator Type | External | Internal + External Crystal |
| Interrupt Sources | Up to 32 | — |
| 工作温度 | -40C to +85C [DATA_NEEDED: confirm automotive grade range] | -40C to +85C |
| Packaging | Tray | — |
| RoHS 状态 | Compliant | — |
| Instruction Set | HC08 + BGND instruction | — |
| On-Chip Debug | BDM (Background Debug Mode) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | S08MM |
| Core Processor | — | HCS08 (S08 CISC) |
| Core Size | — | 8-Bit |
| Core Speed | — | 48 MHz |
| Program Memory | — | 32 KB Flash (32K x 8) |
| Data EEPROM | — | Not specified in datasheet excerpt |
| 电源电压 | — | 1.8 V to 3.6 V (2.5 V/3.3 V typical) |
| 封装 | — | 64-LQFP (10x10 mm) |
| Program Memory Type | — | FLASH |
| Connectivity | — | SCI, SPI, I2C |
| Peripherals | — | PWM, 12-bit ADC, Analog Comparator, Timers |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |
| RoHS | — | Compliant |